IPC 标准检索库

孔壁镀层应连续完整，Class 2 允许不超过 90° 的单一空洞且不超过孔数 5%；Class 3 不允许空洞。切片判定时孔铜断续即判退。

Barrel plating shall be continuous. Class 2 permits a single void up to 90 degrees in up to 5% of holes; Class 3 permits no voids. Discontinuous barrel copper in cross-section is rejectable.

Class 2 孔铜平均厚度不低于 20μm、局部最小不低于 18μm；热应力试验后孔铜无裂纹、无分层为合格。

Class 2 requires average barrel copper no less than 20 μm and local minimum no less than 18 μm; no cracks or delamination after thermal stress test.

阻焊应完整覆盖导线与介质层；Class 2 允许不影响最小电气间隙的侧壁露铜，焊盘区与 BGA 区任何露铜判退。

Mask shall fully cover conductors and dielectric. Class 2 permits sidewall exposed copper not reducing minimum electrical spacing; any exposed copper in pad or BGA areas is rejectable.

阻焊层不允许起泡、起翘或热过程后爆开露铜；任何可见气泡在 Class 3 判退，Class 2 视是否影响绝缘距离判定。

No blistering, lifting or mask blowing exposing copper after thermal processes. Any visible bubble is rejectable for Class 3; Class 2 judged by insulation spacing impact.

基材与介质层间不允许分层或起泡；热应力与 T-288 试验后出现任何分层扩展即判退，需结合切片与超声波扫描确认。

No delamination or blistering between laminate and dielectric layers. Any propagation after thermal stress or T-288 test is rejectable, confirmed by cross-section or C-SAM.

V-CUT 残留厚度通常为板厚 1/3 或按图纸公差；切口不允许伤及导线铜层，板边不允许影响结构的崩缺与裂纹。

V-CUT residual thickness is typically one third of board thickness or per drawing tolerance. Cuts shall not damage conductor copper; edge chipping or cracks affecting structure are rejectable.

OSP 膜厚推荐 0.2-0.5μm；按 J-STD-003 做可焊性试验，润湿面积不低于 95%，焊盘不允许氧化变色与拒焊。

OSP film thickness recommended 0.2-0.5 μm. Solderability per J-STD-003 with wetting coverage no less than 95%; no oxidation discoloration or de-wetting on pads.

Class 2 允许外层环圈破裂不超过环宽 20% 且未触及相邻导体；Class 3 不允许破裂；偏孔需保证最小环宽满足设计余量。

Class 2 permits outer annular ring breakout up to 20% of ring width without touching adjacent conductors; Class 3 permits none. Misdrilled holes shall keep minimum ring width within design margin.

导线截面应接近矩形，侧蚀与钻蚀不超过线宽公差；蚀刻薄化导致线宽低于下限或铜厚不足时判退，需结合切片测量。

Conductor cross-section shall be near rectangular with undercut/overcut within trace width tolerance. Etch thinning below trace width or copper thickness limits is rejectable, verified by cross-section.

焊盘表面不允许影响焊接与键合的划痕、凹坑、外来物与残铜；ENIG 焊盘不允许黑盘与镍腐蚀迹象。

Pad surfaces shall be free of scratches, pits, foreign inclusion and residual copper affecting soldering or bonding. ENIG pads shall show no black pad or nickel corrosion signs.